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reference frequency of 40 kHz):
" N1 = (An × 4 + A × 5) × (En × 4 + E × 5) × 8 × (2[E × 2 + G × 1]) × (F × 1 + Fn × 8)
" Window (T) = N1/Fref
" N2 = (E × 16 × 8 + En × [Dn × 1 +D × 16]) × (G × 2 + Gn × 1)
" Target decimal read out (TDEC) = T × (TIFF/N2 + (E × 247 + En × 79). TIFF is the symbol for target IF frequency
" Target read out hexadecimal (THEX), convert the target decimal read out to hexadecimal and use the 2 least
significant digits (Do not use overflow value). The symbol for measured hexadecimal is MHEX
" Resolution (R) = N2/T
" Measured frequency (FI) = (TIFF) + R × (MHEX - THEX).
Note
1
Care should be taken if TIFF + D 2 filter bandwidth is greater than the frequency for the read out of hexadecimal value FF,
1
or if TIFF - D 2 filter bandwith is less than the frequency at read out for hexadecimal value 00.
" Counter accuracy (AW and AN), with bit 7 (G) the accuracy can be chosen with the same resolution. If bit 7 is logic 1
the accuracy is HIGH and if bit 7 is logic 0 then the accuracy is LOW.
bit 7 = 0, AN = ± (N2/T)
bit 7 = 1, AW = ± (1D 2 × N2/T)
August 1987 24
Philips Semiconductors Product specification
FM/IF system and microcomputer-based
TEA6100
tuning interface
Example
The example uses the following values:
TIFF = 10,7 MHz; accuracy = LOW (G = 0); Fref = 40 kHz (A = 1); IF frequency = 10, 7 MHz (D = 1);
resolution = N1 (F = 1) and counter mode = FM (E = 1)
N1 = (0 × 4 + 1 × 5) × (0 × 4 + 1 × 5) × 8 × (2[1 × 2 + 0 × 1]) × (1 × 1 + 0 × 8) = 800
T = 800/40 = 20 ms
N2 = (1 × 16 × 8 + 0 × [1 × 1 + 0 × 16]) × (0 × 2 + 1 × 1) = 128
TDEC = 20 × 10,7/128 + (1 × 247 + 0 × 79) = 1919
THEX; 1919 is hexadecimal 77F and the least significant 2 digits are 7F, so THEX = 7 F
R = 128/20 = 6400 Hz/count
Assume the readout is '6E', the measured frequency will be:
" FI = 10,7 + (6E - 7F) × 6400 = 10,59 MHz
Assume the readout is '83', the measured frequency will be:
" FI = 10,7 + (83 - 7F) × 6400 = 10,726
August 1987 25
Philips Semiconductors Product specification
FM/IF system and microcomputer-based
TEA6100
tuning interface
PACKAGE OUTLINE
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
D ME
A2 A
A1
L
c
e
Z w M
b1
(e )
1
b
20 11 MH
pin 1 index
E
1 10
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A A 1 A 2 b b1 c D (1) (1)
Z
UNIT E e e1 L ME MH max.
w
max. min. max.
1.73 0.53 0.36 26.92 6.40 3.60 8.25 10.0
mm 4.2 0.51 3.2 2.54 7.62 0.254 2.0
1.30 0.38 0.23 26.54 6.22 3.05 7.80 8.3
0.068 0.021 0.014 1.060 0.25 0.14 0.32 0.39
inches 0.17 0.020 0.13 0.10 0.30 0.01 0.078
0.051 0.015 0.009 1.045 0.24 0.12 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE EUROPEAN
ISSUE DATE
VERSION PROJECTION
IEC JEDEC EIAJ
92-11-17
SOT146-1 SC603
95-05-24
August 1987 26
seating plane
Philips Semiconductors Product specification
FM/IF system and microcomputer-based
TEA6100
tuning interface
with the joint for more than 5 seconds. The total contact
SOLDERING
time of successive solder waves must not exceed
Introduction
5 seconds.
There is no soldering method that is ideal for all IC
The device may be mounted up to the seating plane, but
packages. Wave soldering is often preferred when
the temperature of the plastic body must not exceed the
through-hole and surface mounted components are mixed
specified maximum storage temperature (Tstg max). If the
on one printed-circuit board. However, wave soldering is
printed-circuit board has been pre-heated, forced cooling
not always suitable for surface mounted ICs, or for
may be necessary immediately after soldering to keep the
printed-circuits with high population densities. In these
temperature within the permissible limit.
situations reflow soldering is often used.
Repairing soldered joints
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
Apply a low voltage soldering iron (less than 24 V) to the
our IC Package Databook (order code 9398 652 90011).
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
Soldering by dipping or by wave
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
The maximum permissible temperature of the solder is
between 300 and 400 °C, contact may be up to 5 seconds.
260 °C; solder at this temperature must not be in contact
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
August 1987 27
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